WaferClean 2100

Eco-Snow®'s advanced WaferClean™ 2100 system is a proven, value-added process tool used for particulate, post CMP or ion mill redeposition (veil and fence) removal. It is also used for metal lift-off, metal stringer and nano defect removal from 2 to 8 inch wafers. Eco-Snow's dry CO2 precision cleaning is a fast, environmentally friendly, non-contact process that offers numerous advantages over conventional cleaning methods: superior cleaning performance, higher yields, reduced cycle times, a small footprint, and low cost of ownership.